Flowable, flexible heat-cure silicone for superior heat dissipation in ECU’s.
Today’s vehicles have an increasing number of ECUs with expanding levels of electronic complexity and heat generation. Materials manufacturer, Momentive, has introduced Silcool XE13-C1862PT adhesive, to enhance the dissipation of heat generated by the electronics. As a result the ECU’s are made more reliable and premature failure is prevented.
According to Andy Briars, Technical Director at Momentive’s distribution partner, Techsil, “A key design requirement of many Electronic Control Units (ECU’s) is high-performance heat dissipation to ensure efficient operation and protection of sensitive components. As higher operating temperatures are generated by increasingly small systems and rising circuit densities, efficient thermal management solutions are in high demand. Heat generating microprocessors are commonly mounted on ceramic or metal-core PCBs to increase thermal transfer efficiency. These PCBs are attached to a heat sink by a thermally conductive adhesive such as Momentive’s Silcool XE13-C1862PT”
Silcool XE13-C1862PT is a one-component, heat curable silicone adhesive designed for applications where thermal conductivity is required. The product cures quickly with heat and adheres well to a variety of substrates without the use of a primer and has a typical thermal conductivity of 2.5 W/m.K. In addition, the product is a flowable material that can be applied in a variety of ways, eg. basic dispensing, pin-transfer and screen-printing, so it is easy work with in an industrial setting.
Compared to other competitive TIM adhesives with a similar level of thermal conductivity, Silcool XE13-C1862PT has a higher level of flexibility that can be seen in its typical elongation at break level of 80%. This property allows the Bond Line Thickness (BLT) to be reduced to a level of 50-70 microns. Its flexibility also helps compensate for mechanical movement induced by thermal cycling and Co-efficient of Thermal Expansion (CTE) differences between the heat sink and PCB materials. Furthermore, since thermal resistance is proportional to the thickness of the material through which the heat must travel, this BLT reduction results in reduced thermal resistance of the overall construction, improving the reliability and preventing premature failure of ECUs in the field.
Mr. Mark Fraser, Regional Marketing Manager Automotive Electronics at Momentive comments, “We are pleased with how quickly our thermal management solutions are gaining acceptance among automotive tier 1 manufacturers. With products such as our Silcool XE13-C1862PT, we are helping them to achieve the high performance levels required by OEMs without compromising on productivity which is so important to the industry as a whole”.
For a technical datasheet on Silcool XE13-C1862PT, please contact Techsil on sales@techsil.co.uk
Click here to find out about other Thermal Management Materials from Momentive
To view the full electronics range from Momentive visit our Brochure Download page
Techsil’s RTV191** Range are UV-curing, solvent free silicones which combine the quick curing speed of UV adhesives with the excellent temperature resistance of silicone sealants.
Portions directly exposed to UV rays cure in seconds whilst other areas cure by moisture in the air without adding heat. After curing, the product becomes an elastic rubber which can be used on electronic assemblies for bonding, potting, sealing or coating. Typical uses include conformal coatings and sealing of connectors.
The ability of this material to cure with both UV light and moisture mean that any portions in ‘shadow’ will still cure. The resulting cured material remains elastomeric meaning that it stays flexible giving good protection from vibrations.
These products contain less than 0.03% of low molecular siloxane which reduces the damaging effects to electrical contacts.
Other features of this range include:
- Being a one part non solvent resin these materials can be easily applied without the need for specialist equipment.
- When exposed to UV-radiation at a wavelength range of 200 ~ 400 nm, within seconds, the product develops an elastic perfectly adhering seal
- Areas which are not exposed to UV-light, cure additionally by air humidity
- Low ion density and negligible metal corrosion
- Excellent chemical and thermal resistance (- 60°C ~ 200°C)
- Very good vibration damping and shock absorbing properties
The main component of the RTV191** range is silicone resin resulting in good elasticity and excellent resistance to heat, cold and moisture. A range of viscosities, including gels offer customer tailored solutions.
For more information about Techsil’s RTV191* range or for samples, please contact us on 01789 773232 or technical@techsil.co.uk
Techsil thixo gel targets electronic applications
Techsil has launched the RTV3080 thixo gel designed for electronic applications such as engine-control units, power steering modules and power semiconductors.
The thixo gel has five times the thermal conductivity of normal RTVs, a non-greasy consistency and the ability to 're-seal' itself after cure.
Its main features include: 1:1 mix ratio and easier to pump than similar
existing materials; 1.0w/m/k thermal conductivity; non-greasy consistency means there are no leakages at high or low temperatures; gel is 'self-sealing' allowing probe testing, adjustment to components or disassembly and re-use of parts at end-of-life.
The RTV3080 is flowable but thixotropic meaning that the spread can be controlled, and it is soft enough not to stress components.
The thixo gel cures at room temperature with a four-hour gel time and a 24 hour cure, but can be heat-accelerated if needed.
Techsil supplies RTV3080 thixo gel in 50ml, 215ml, 395ml cartridges or manual mix kits.
Contact Techsil to request a sample or to see a technical datasheet
sales@techsil.co.uk
IVS4742 LED encapsulant
Momentive Performance Materials has developed IVS4742, a self bonding LED encapsulant material with a viscosity and clarity that enables low pressure direct on-board lens moulding.
Direct on-board lens moulding is a major step forward in process simplification, since it combines the potting, lens moulding and mounting steps into 1 process.
IVS4742 is an excellent candidate to consider for use in the direct on-board moulding process since its low viscosity allows low pressure which helps minimize risk for LED damage. Its cure speed typically enables IVS4742 to be demoulded after 2 minutes at 150°C, however further post-cure is required to assure completion of cure and adhesion to substrates. Naturally the mould itself needs to feature ease of demould properties (e.g. a Teflon layer).
Permatex Threadlocker Gel
Permatex Threadlocker Gels are truly innovative products. The unique patented GEL TWIST applicator leaves the threadlocker precisely where you want it with no drips or solid stick globs. The easy-to-use dispenser reduces waste and therefore costs. The gel provides the same application reliability as liquid threadlockers; securing fasteners against loosening from vibrations and protecting threads from corrosion.
The threadlocker comes in two strengths
Medium strength BLUE gel - for all-purpose nut and bolt applications 6mm to 25mm.
High strength RED gel - for heavy-duty nut and bolt applications 10mm to 25mm and longer.
Both come in handy 10g dipensers which are portable and convenient; toolbox and pocket friendly.