1 Component RTV

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Moisture / air curing adhesives, sealants and coatings which cure to a maximum depth of 10mm. Products exhibit adhesion to many surfaces and are available in a wide range of viscosities (flow-ability) and cure systems.

1 Component Heat Cure

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Properties same as 1 Component RTV but cures with heat >100°C and not moisture.

2 Component RTV (Industrial)

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Intended as potting and encapsulant materials to improve electrical and environmental resistance. These products require the addition of a catalyst to initiate cure which may take place at room temperature or in certain cases can be accelerated with heat.

2 Component RTV (Mould making)

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These high tear strength, room temperature cure products are designed to produce flexible moulds directly from original masters. A variety of resins can be poured or injected into the mould to produce a number of replica parts. Two ranges exist:

• Condensation cure for the giftware, plaster and ceramic industries and
• Addition cure/polyurethanes for rapid prototyping and composite mouldings.

Pressure Sensitive Adhesives (PSA)

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PSA are materials which cure to form a thin section, hard yet flexible silicone resin. The cure can take place at ambient or elevated temperatures depending on the chosen grade. The products typically act to laminate between two surfaces - one of which is usually silicone based. These are ideal adhesives to use where a one component heat cure or RTV product would prove unsuitable. Adheres to most surfaces with very slight pressure. Pressure sensitive adhesives form viscoelastic bonds that are aggressively and permanently tacky, they adhere without the need of more than a finger or hand pressure and require no activation by water, solvent or heat.

Thermal Conduction

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Our range of silicones can withstand high temperatures. Our silicones help dissipate thermal stress from sensitive components. Work is ongoing with potential products reaching > 5.0 W/M/K and improvements in the thermal interface reduce resistance further.

Adhesive/Sealant

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Adhesives are chosen for their holding and bonding power often having high shear and tensile strength. Sealants are generally chosen for their ability to fill gaps, accommodate the relative movement of the substrates and exclude or contain other substances. They are generally lower in strength than adhesives but have better flexibility.

Apart from an ability to bond or seal to a substrate, other properties should be considered during initial product selection, these choices include: Chemical Resistance, Modulus (resistance to stretch/recovery), Colour, Tensile Strength, Cure speed, Temperature range, Hardness (Rigid or Flexible), Viscosity.

Potting/Encapsulation

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Used to insulate, seal and increase performance of electronic and electrical devices,

Including the protection of automotive electronics, control boxes, potting and sealing of cable joint assemblies.

• Provide environmental protection
• Protect from vibration
• Provide electrical insulation
• Allow fast efficient heat transfer from electronic components to heat sinks or outer casings.
• Are suitable for both thin and deep section cure

Standard current applications include:

• Transformers
• PCB Encapsulation
• Electronic Components
• Switchgear
• Capacitors / Suppressors
• Ballasts / Lighting
• Cable Jointing

Techsil encapsulants and potting compounds feature:

• Wide range of mix ratios, hardness, viscosity
• UL94 V-0 grades
• Optically clear grade
• Soft gels
• Thermally conductive grades

Techsil encapsulants and potting compounds are available as Polyurethane, Silicone and Epoxy products offering specific operating characteristics. The ranges offer UL94-V0 flame retarding where required e.g.

• Polyurethane – Lower cost, elastomers and rigid systems. Temperature is limited to -50 to 130°C max.

• Silicones – Can go from -115 to 315°C and offer very low dielectric constant and a dielectric strength of 22KV 

• Epoxies – Used for encapsulation where a tough, rigid, durable encapsulant is needed

Mould Making

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Because of the unique chemistry of silicone, Room Temperature Vulcanising (RTV) silicone rubber is widely recognised as the highest quality and most versatile mould making material available.

Due to its inherent heat resistance, exceptionally low shrinkage and resistance to the vast majority of organic and inorganic materials, silicone rubber is an ideal solution for a wide range of moulding requirements. Polyester resins, epoxy resins, low melting metals (such as pewter), acrylics, urethane foams, concrete, waxes and plasters, can all be formed using silicone rubber moulds.

Techsil's silicone moulding rubbers are supplied as two part liquids. When the two parts are mixed the rubber cures at room temperature, without releasing heat, to form a strong, dimensionally stable mould.