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Encapsulation

Used to insulate, seal and increase performance of electronic and electrical devices, including the protection of automotive electronics, control boxes, potting and sealing of cable joint assemblies.

Electronic Encapsulation

Encapsulation involves insulating, sealing and protecting electronic and electrical devices or circuit boards (PCBs). Characterised by an excellent level of mechanical properties, good high temperature performance and good adhesion to a wide variety of substrates, encapsulation materials are well recognised for increasing performance of electronic devices.  

The term ‘encapsulation’ is often used interchangeably with the term ‘potting’; the difference between the two is that ‘potting’ involves a ‘pot’ or case or shell to put the device in and then the liquid potting compound is poured in and envelopes the device; the case becomes part of the finished product. The process of encapsulation does not include a ‘pot’ or case, instead the resin coating is applied to the part or the part is dipped in the resin to form a robust coating. Sometimes a mould is used instead of a case and removed once the compound has cured.

The complete range of encapsulation and potting materials offered by Techsil is used extensively across diverse electrical and electronic assembly applications. Valued for their ability to enhance production processes, encapsulation and potting compounds offer specific operating characteristics that optimise end product quality and support new and innovative design concepts.

Typical Uses of Encapsulation Compounds

Typical applications include the protection of automotive electronics, control boxes, potting and sealing of cable joint assemblies.

Examples of typical uses and benefits include:   

   -   Delivering environmental protection
   -   Protecting from vibration
   -   Providing electrical insulation
   -   Allowing fast and efficient heat transfer from electronic components to heat sinks or outer casings
   -   Suitability for both thin and deep section cure
 

Specific applications include:

   -   Power Supplies
   -   Switches
   -   Sensors
   -   Connectors
   -   Capacitors
   -   Transformers
   -   Rectifiers
   -   Cable Harness Assemblies
   -   LED Lighting Modules and Luminaires
   -   Submersible Pumps
   -   Ignition coils
   -   Motors
   -   Sensors

Encapsulation Materials

 Techsil encapsulants and potting compounds are available as polyurethane, silicone and epoxy products offering specific characteristics.

    -   Polyurethanes – lower cost, elastomers and rigid systems. Temperature is limited to -50˚C to 130˚C max
    -   Silicones – Can go from -115 to 315˚C and offer very low dielectric constant and a dielectric strength of 22KV
    -   Epoxies – Used for encapsulation where a tough, rigid, durable encapsulant is needed
    -   Coatings – When potting is not possible due to reasons of layout or added cost, it may be possible to coat the wound component, PCB or assembly with materials using a variety of techniques such as spraying, dipping, brushing or dispensing

Types of Encapsulation and Potting Materials Available

Offering a wide range of mix ratios, hardnesses, curing types and viscosities, Techsil’s complete range of encapsulant and potting compounds includes

   -   Optically clear grades
   -   Hard epoxies to soft gels
   -   UV curable encapsulants
   -   Thermally conductive grades
   -   UL94 V-0 grades
   -   NASA low outgassing
   -   USP Class VI for medical use
   -   FDA CFR 175.300 for food grade
   -   Low viscosity, self-leveling rigid, semi-rigid and flexible compositions eliminate gas entrapment and are ideal for high volume production applications

 

 

 

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