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Potting

Used to insulate, seal and increase performance of electronic and electrical devices, including the protection of automotive electronics, control boxes, potting and sealing of cable joint assemblies.

Potting involves the process of filling to insulate, seal and protect electronic and electrical devices. Valued for their specific operating characteristics, potting compounds optimise productivity and long term performance.

The term ‘encapsulation’ is often used interchangeably with the term ‘potting’. The difference between the two is that ‘potting’ involves a ‘pot’ or case or shell to put the device in and then the liquid potting compound is poured in and envelopes the device; the case becomes part of the finished product.

The process of encapsulation does not include a ‘pot’ or case, instead the resin coating is applied to the part or the part is dipped in the resin to form a robust coating. Sometimes a mould is used instead of a case and removed once the compound has cured.

Techsil offers a wide range of potting compounds that are used across many different electrical and electronic assembly applications.

Typical Applications of Potting

Used extensively across different sectors and industries, examples of typical applications include the potting of automotive electronics, control boxes, transformers, ballasts and cable joint assemblies.

Examples of typical uses and benefits include:

   -   Providing environmental protection
   -   Protecting from vibration
   -   Electrical insulation
   -   Fast and efficient heat transfer from electronic components to heat sinks or outer casings

Specific applications include:

   -   Transformers
   -   PCB encapsulation
   -   Electronic components
   -   Switchgear
   -   Capacitors / Suppressors
   -   Ballasts / Lighting
   -   Cable jointing

 

Key Characteristics of Potting Materials

   -   Polyurethanes – lower cost, elastomers and rigid systems. Temperature is limited from -50˚C to 130˚C max

   -   Silicones – can go from -115 to 315˚C and offer very low dielectric constant and a dielectric strength of 22KV

   -   Epoxies – used where a tough, rigid, durable encapsulant is needed

   -   Coatings – when potting is not possible due to reasons of layout or added cost, it may be possible to coat the wound component, PCB or assembly using a variety of techniques such as spraying, dipping, brushing or dispensing.

 

Types of Potting Materials Available

Offering a wide range of mix ratios, hardness and viscosity:

   -   UL94 V-0 grades
   -   Optically clear grade
   -   Hard epoxies to soft gels
   -   Thermally conductive grades

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