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Potting

Used to insulate, seal and increase performance of electronic and electrical devices, including the protection of automotive electronics, control boxes, potting and sealing of cable joint assemblies.

Used to insulate, seal and increase performance of electronic and electrical devices, including the protection of automotive electronics, control boxes, potting and sealing of cable joint assemblies.

Potting and Encapsulation Compounds:
    - Provide environmental protection
    - Protect from vibration
    - Provide electrical insulation
    - Allow fast efficient heat transfer from electronic components to heat sinks or outer casings.
    - Are suitable for both thin and deep section cure

Standard current applications include:
    - Transformers
    - PCB Encapsulation
    - Electronic Components
    - Switchgear
    - Capacitors / Suppressors
    - Ballasts / Lighting
    - Cable Jointing

Techsil encapsulants and potting compounds feature:
    - Wide range of mix ratios, hardness, viscosity
    - UL94 V-0 grades
    - Optically clear grade
    - Soft gels
    - Thermally conductive grades

Techsil encapsulants and potting compounds are available as Polyurethane, Silicone and Epoxy products offering specific operating characteristics. The ranges offer UL94-V0 flame retarding where required e.g.
  • - Polyurethane - Lower cost, elastomers and rigid systems. Temperature is limited to -50 to 130°C max.
  • - Silicones -  Can go from -115 to 315°C and offer very low dielectric constant and a dielectric strength of 22KV 
  • - Epoxies – Used for encapsulation where a tough, rigid, durable encapsulant is needed
  • - Coatings - When potting is not possible due to reasons of layout or added cost, it may be possible to coat the wound component, PCB or assembly with materials using a variety of techniques such as Spraying, Dipping, Brushing or Dispensing.

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