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Thermal Management

Techsil offer a range of thermally conductive silicones and epoxies to aid with your thermal management. Suitable for Power modules; Converters; IGBT units; Semiconductor packages e.g. CPU's; Power Sensors; Board assemblies; LED's; Power supplies and Automotive Control Units.

During use, electronic components can generate significant amounts of heat. Failure to effectively dissipate this heat can impact reliability and reduce operational lifetimes.Thermal Interface Materials (TIMs) are inserted between components to enhance thermal transfer to deliver better heat dissipation. They are typically used in combination with heat sinks to manage the increasing load arising from smaller and more powerful components in modern high powered electronics. While fans, heat sinks, and even liquid cooling and thermoelectric devices can be used to provide enough cooling power, the problem remains to get the heat from the hot components into the cooling hardware. Thermal Interface Materials (TIMs) are designed to fill in air gaps and microscopic irregularities, resulting in dramatically lower thermal resistance and thus better heat dissipation and cooling.

Techsil provides a comprehensive range of high performance TIMs offering high thermal conductivity. These include greases, pastes, adhesives (heat cure and condensation cure), gels, encapsulants, tapes and thermal pads.

 

Typical Applications of Thermal Management

 Used across different industries, these materials aid effective thermal management in a wide range of electronic assemblies including:

  •    -   Power modules
  •    -   Converters
  •    -   IGBT units
  •    -   Semiconductor packages such as power sensors, board assemblies, LEDs, power supplies, automotive control units

 

Key Characteristics of Thermal Management Materials

 With a wide range of chemistries and types Techsil’s TIMs offer:

  •    -   High strength bonding on numerous substrates
  •    -   Enhanced thermal transfer for better heat dissipation
  •    -   Compensation for thermal expansion differences
  •    -   Extended component life
  •    -   Gap filling ability
  •    -   Ageing stable elasticity
  •    -   Mechanical shock resistance
  •    -   Protection against static discharge
  •    -   High and low temperature resistance
  •    -   Chemical and moisture resistance
  •    -   Vibration, impact and shock resistance
  •    -   Exceptional durability, environmental resistance

 

Types of Thermal Management Materials Available

  •    -   Epoxies
  •    -   Silicones
  •    -   Polyurethanes
  •    -   Tapes
  •    -   Greases

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