3M™ ScotchWeld™ EC-9323 B/A Epoxy Adhesive 1L
3M™ ScotchWeld™ EC-9323 B/A is a room temperature curing epoxy paste adhesive. It is thixotropic, sag-resistant and creates an impact resistant structural bond.
ScotchWeld™ EC-9323 bonds to a ariety of substrates such as metals, glass, ceramics and plastics, incl. GFRP and CFRP.
- Thixotropic, non-sag, full room emperature processable
- Toughened system providing very high shear and peel strength
- Excellent environmental resistance
- Colour: Part B - White, Part A - Off-White
- Base: Part B - Modified epoxy, Part A - Modified amine
- Consistency: Thixotropic paste
- Density: Part B - 1.04g / cm, Part A - 1.03g / cm
- Solids: 100%
- Viscosity: Part B - 250Pas, Part A - 75Pas
- Mix ratio by weight: 100 : 50 wt.