TECHSiL® Non Silicone Heat Transfer Compound 620gm

TECHSiL® HTC is a non-silicone heat transfer compound with a high thermal conductivity (0.9W/mK) designed for thermal coupling of electrical components. HTC is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required or between any surface where thermal conductivity or heat dissipation is important.

HTC contains no silicones and thus cannot migrate onto electrical contacts with consequent high contact resistance, arcing or mechanical wear. Similarly, soldering problems caused by silicones will not be encountered. HTC will perform in applications where the maximum service temperature does not exceed +130°C. Applications that need to operate beyond this limit will require a silicone based product.

Product Features

Technical Properties