Momentive SilCool™ TIA216G Thermally Conductive Silicone 4.4lb

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SilCool™ TIA216G is a 2 component, thermally conductive potting material from Momentive Performance Materials. Developed to be used primarily on complex thermal interface designs. The product has a low viscosity which allows it to conform to intricate shapes, enabling the reduction of contact interference.

TIA 216G quickly cures to a 40 Shore E soft rubber/gel consistency with exposure to heat and retains a tacky adhesion on its cured surface.

Product Benefits

  • Good Thermal Conductivity
  • Low Viscosity
  • Fast cure with exposure to heat
  • Room temperature cure capability
  • Easy to use 1:1 mix ratio by weight & volume
  • Repairability
  • Non-corrsive to metals
  • UL 94V-0 Compliance (file number E56745)

Technical Properties

  • Colour: Grey
  • Cured Shore Hardness: 40 Shore E
  • Dielectric Strength: 20kv/mm
  • Thermal Conductivity:1.6 W/mK
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