Panacol Elecolit® 323 Silver Filled Epoxy 28gm
Elecolit® 323 is a silver filled two part epoxy adhesive specially developed for bonding open chip components.
This semiconducting grade has passed the autoclave test (1000h) and is suitable for use on semi conductors, it has no effect on bond wire adhesion. It can cured at either room temperature or thermally with the exposure of heat, further details on curing can be found on the TDS.
Supplied in a 28gm Kit Size