Tecbond® 261 12 High performance Hot Melt Adhesive

Tecbond 261 is a versatile and strong hot melt adhesive ideal for general purpose and product assembly applications.

This adhesive offers a high bond strength and flexibility to withstand small substrate movements, as well as a long open time.

Tecbond 261 is able to bond a variety of substrates including wood, metal, glass, ceramics, and many plastics, including polypropylene.

Quantity per box: 170 Sticks

Technical properties:

• Chemistry: EVA
• Application temp: 130-195°C
• Softening point: 85°C
• Low temp: 0°C
• Open time: 30 seconds
• Heat resistance: 75°C
• Colour: pale amber