Techsil offers a comprehensive portfolio of products that meet a wide array of handling and performance needs for electronic devices and component assemblies.

Providing solutions for bonding components, sealing against moisture or environmental ingress, coating components, underfilling, potting, encapsulation and thermal management, examples of typical applications include PCB and junction coating, component encapsulation, wire connector sealing, ECU potting, die attaching, glob top sealing and plastic housing bonding.

Material Systems for Electronics: Product Categories 

As well as offering a full range of dielectric, high temperature, semi-flowable, paste, low corrosive and flame retardant silicone systems, Techsil also markets a variety of encapsulants, potting compounds, conductive and heat transfer tapes, flame retardant epoxies, metal primers, electrical potting and UV adhesive systems.

To Top