Electronics Industry

TECHSiL offers a comprehensive portfolio of products that meet a wide array of handling and performance needs for electronic devices and component assemblies.

Providing solutions for bonding components, sealing against moisture or environmental ingress, coating components, underfilling, potting, encapsulation and thermal management, examples of typical applications include PCB and junction coating, component encapsulation, wire connector sealing, ECU potting, die attaching, glob top sealing and plastic housing bonding.

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Manufacturers

TECHSiL, in unison with their key supply partners, are a driving force in supply of advanced thermal silicone technology to the electronics industry. A wide portfolio of thermal interface materials are available providing flame retardancy, thermal conductivity, temperature resistance, low-volatility, or high-purity benefits. As well as offering a full range of dielectric, high temperature, semi-flowable, paste, low corrosive and flame retardant silicone systems, TECHSiL also markets a variety of encapsulants, potting compounds, conductive and heat transfer tapes, flame retardant epoxies, metal primers, electrical potting and UV adhesive systems.

Electronics Product Portfolio

Dispensable Ultra-High Thermal Conductivity Gap Fillers

Visit our Resource Centre and discover a comprehensive collection of informative videos, white papers, and technical guides that examine our innovative approach to the Electronics industry.

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