Momentive SilCool™ TIA241GF Thermal Gap Filler 3.6kg Kit

SKU

MOSI17211

TIA241GF 3.6kg(7.93lb) Sem Kit

Momentive SilCool™ TIA 241 GF is a 2 part, thermally conductive silicone that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, the non-slumping paste consistency of TIA214 GF provides physical stability to prevent run-off after dispense.

Recommended for use as a liquid dispensed alternative to pre-fabricated thermal pads and as a gap filler for a broad array of thermal designs in electronic components. Suitable for use in consumer, telecommunications, automotive and lighting electronic component applications.

Product Benefits

Good Thermal Conductivity

Low temperature, fast cure

Easy to use

Retains softness after cure to contribute to stress relief during thermal cycling

Conforms to complex shapes of 3-dimensional interface designs

Repairable

Flame Retardant:UL94V-0 equivalent

Technical Properties

Uncured Consistency:Blue Paste

Cured Shore Hardness:45 A

Thermal Conductivity:4.1 W/mK