Momentive SilCool™ TIA241GF Thermal Gap Filler 3.6kg Kit

TIA241GF 3.6kg(7.93lb) Sem Kit
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Momentive SilCool™ TIA 241 GF is a 2 part, thermally conductive silicone that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, the non-slumping paste consistency of TIA214 GF provides physical stability to prevent run-off after dispense.

Recommended for use as a liquid dispensed alternative to pre-fabricated thermal pads and as a gap filler for a broad array of thermal designs in electronic components. Suitable for use in consumer, telecommunications, automotive and lighting electronic component applications.

Product Benefits

  • Good Thermal Conductivity
  • Low temperature, fast cure
  • Easy to use
  • Retains softness after cure to contribute to stress relief during thermal cycling
  • Conforms to complex shapes of 3-dimensional interface designs
  • Repairable
  • Flame Retardant:UL94V-0 equivalent

  • Technical Properties

  • Uncured Consistency:Blue Paste
  • Cured Shore Hardness:45 A
  • Thermal Conductivity:4.1 W/mK
  • Thermal Resistance:30 mm2.K/W
  • Dielectric Strength:16 kV/mm
  • Tensile Strength:0.2 Mpa
  • Elongation:40%
  • Operating Temperature:-60°C to +200°C
  • For commerical or industrial purposes only

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