Momentive SilCool™ TIA241GF Thermal Gap Filler 3.6kg Kit
Momentive SilCool™ TIA 241 GF is a 2 part, thermally conductive silicone that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, the non-slumping paste consistency of TIA214 GF provides physical stability to prevent run-off after dispense.
Recommended for use as a liquid dispensed alternative to pre-fabricated thermal pads and as a gap filler for a broad array of thermal designs in electronic components. Suitable for use in consumer, telecommunications, automotive and lighting electronic component applications.