Thermal Interface Materials (TIM's) are our biggest & fastest growing product category. As electronic devices get smaller - known as miniaturisation - we build PCB’s with higher energy density with more components in a smaller space and ever increasing operating temperatures. It means we need better and reliable cooling and temperature control of our devices when we use them.

It’s all about the heat transfer to the heat sink and thermal ratings, bond line thickness, surface contact all play a part.  Our TIM pastes offer an efficient heat path and thermal stress resistance which will extend the product life of your electronic devices.

TIM adhesives are offered both as air cured and heat cured and are available in a range of viscosities, thermal ratings and a variety of pack sizes from syringes, tubes, cartridges and pails to aid consistent dispensing.

In this post we are highlighting Techsil’s Top Ten of our most popular thermal management products and their features and benefits which might hopefully help you to select the right product for your application.  Here goes…


Momentive TIA0260

Momentive TIS420C Gap Filler

  • Thermal conductivity 4.2W/mK
  • 1-part non-flowable, repairable silicone paste
  • Room temperature curing
  • Pillow cure, dry on the outside & soft on the inside
  • 30 minutes tack free time
  • Gives stress relief & pump out resistant

Momentive TIG210BX Silicone Grease

  • Thermal conductivity 2.1 W/mK
  • 1-Part non-flowable, repairable silicone grease
  • Gives a thin bond line
  • Wide operating temperature range (-40°C ~ 150°C)
  • Very low bleed out & weight loss, stays in place

TIA0260Momentive TIA0260 Silicone Adhesive

  • Thermal conductivity 2.6 W/mK
  • 1-part semi-flowable silicone paste
  • Room temperature curing (TFT 10 mins)
  • UL94 V-0
  • Good adhesive properties

Momentive TIA350R Silicone Adhesive

  • Thermal Conductivity 3.5 W/mK
  • Excellent heat dissipation
  • 1-part, heat cure, silicone paste
  • Low temperature fast cure
  • Cures to a 77 Shore A, tough rubber
  • Thermal interface between dies and heat spreaders

Momentive TIA213G Potting & Encapsulation

  • Thermal Conductivity 1.3 W/mK
  • 2-part, heat cure, very low viscosity flowable silicone
  • Room temperature cure - 24 hours
  • Soft 23 Shore A, elastic rubber

Techsil TIM11123 GBMomentive XE11 B5320 Low Volatile Adhesive

  • Thermal conductivity 1.3 W/mK
  • 1-part, low volatile silicone paste
  • Room temperature curing (TFT 5 mins)
  • Cures to a 83 Shore A, tough rubber
  • Low linear shrinkage
  • Non corrosive and solvent free

Momentive TIA225GF Silicone Gap Filler

  • Thermal Conductivity 2.5 W/mK
  • 2-part AC cure
  • Non flowable, dark grey paste
  • Soft stress absorbing RTV rubber

Momentive 1:1 Pail Kit

Momentive TIA208R Potting Silicone Encapsulant

  • Thermal conductivity 0.7 W/mK
  • 2-part 1:1 mix, heat cure silicone
  • High temperature, UL94-V0
  • Low viscosity to conform to intricate shapes
  • Soft, elastic with tacky adhesion

Momentive TIA216G Soft Silicone Potting Encapsulant

  • Thermal conductivity 1.6 W/mK
  • 2-part 1:1 mix, heat cure silicone
  • Low viscosity to conform to intricate shapes
  • Soft, elastic with tacky adhesion

Momentive TIA222G Soft Silicone Potting EncapsulantTechsil 20oz

  • Thermal conductivity 2.2 W/mK
  • 2-part 1:1 mix, heat cure silicone
  • Low viscosity to conform to intricate shapes
  • Soft, elastic with tacky adhesion
  • UL94-V0

Momentive TIA241GF Gap Filler

  • Thermal conductivity 4.1 W/mK
  • 2-part, heat cure, non-slumping silicone paste
  • Fast low temperature curing
  • Cures to a 30 Shore A, flexible rubber
  • Flame retardant UL94V-0
  • Easily liquid dispensed automatically
  • 180µ & 250µ glass bead options available
  Contact for more information.