Thermal Management Solutions for Data Centres
Efficient thermal management and cooling solutions are critical to the performance of data centres. With the expansion of artificial intelligence, e-commerce, cryptocurrency, and data driven services, data centres are growing in importance and size - as does the challenge of finding effective cooling and thermal management solutions.
Electrical components can only stand a certain level of heat and with data centres running constantly, they get extremely hot. This excessive heat can cause hardware damage, higher energy bills, shorter equipment lifespan, and in extreme cases, fires. Making efficient heat dissipation solutions critical to the data centre industry.
HOW ARE DATA CENTRES KEPT COOL?
Thermal management is required to keep data centre servers and equipment at optimal temperature; to do this, various cooling systems are put in place.
Cooling solutions for data centres can be split into two areas: active and passive. Active cooling utilises external devices like air conditioners, fans, and HVAC systems, to remove heat – this method requires external power, consuming more energy. Passive cooling, considered an eco-friendlier option, utilises mechanical tactics and natural heat dissipation. This includes heat sinks and thermal interface materials to transfer heat away from sensitive components.
WHY USE THERMAL INTERFACE MATERIALS FOR DATA CENTRE COOLING
Thermal Interface Materials (TIMs) are system level, passive thermal management solutions. Cost effective and energy efficient they are used in electronics to maintain the optimal performance of components.
Thermal Interface Materials fill micro air pockets to provide a heat path from a heat source to dissipation device like heat sinks, without this, heat cannot dissipate effectively. TIMs can also be used for potting and encapsulation of sensitive components like PCBs and power supply modules in switches, serves, and storage units. By using Thermal interface materials, heat is removed, the processing speed and functionality of devices is maintained, and electronic components can last longer.
Types of Thermal Interface Materials include silicone grease compounds, conductive adhesives, and liquid gel/gap fillers
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PRODUCTS TO CONSIDER
Momentive SilCool Silicone Compounds and Adhesives:
Momentive’s SilCool range of high-performance silicone grease compounds are formulated specifically to address heat management challenges in electronics. Key features of this range include excellent workability, high thermal conductivity, wide operating temperature, and low oil separation.
Momentive SilCool silicone adhesives bond well to a variety of substrates, delivering outstanding thermal conductivity, low thermal resistance, and excellent dielectric properties. Featuring thin bond lines and excellent adhesion, this range of heat cured adhesives excel in thermal interface applications such as to heat sinks.
TECHSiLs Thermal Interface Materials
As industry experts in thermal management, TECHSiL has a comprehensive range of high-performance thermal interface materials, including liquid TIMs; thermally conductive potting compounds, silicone pastes and greases.
For more information about thermal interface material solutions for the data centre industry, contact our technical team here.