SilCool* TIA208R Thermally Conductive Silicone Encapsulant
Fast cure (2 component room temperature curable) thermally conductive potting
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Key Features
- Primerless adhesion to metals and plastics
- Good thermal conductivity (0.7 W/m∙K)
- Easy to use 1:1 mixing ratio
- Cures and adheres quickly with heat or at room temperature
- Flame retardant : UL94V-0
- UL RTI : 150°C
- UL Rated
Applications
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Potting in LED Light Bulbs
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TIA208R resulted in a 16 % reduction in operating temperature
Curing Behaviour
- Although curing is possible at various temperatures, higher temperatures result in higher hardness and adhesion strength build.
- Even when cured in ovens for 30 min, there is a gradual increase in hardness and adhesion strength that continues for approximately 7 days.
Temperature and Viscosity Relationship
Stable properties under harsh operating conditions
Categories: Momentive SilCool™ Thermal Management