Structalit - Max Strength Multi-Purpose Adhesives
The Structalit® range from Panacol are maximum strength structural 1 and 2 part epoxy based adhesives used for multiple purposes such as bonding metal constructions or in electronics as a glob top sealant, dam and fill material, SMD adhesive and potting compound. Ideal for bonding a wide range of substrates from metals, glass, ceramics, wood, rigid foam and plastics.
Panacol Introduces New High Performance Frame-and-Fill Adhesives
Frame-and-fill processes are used to protect highly complex areas on electronic circuit boards. In the first step, a highly viscous barrier - the so-called frame - is applied. In the next step, this area is quickly filled with lower viscosity filler material – the fill. With this precise process, areas on the circuit board can be protected from mechanical impact factors.The combination of frame-and-fill materials allows the application of minimum barrier and potting heights and cures to a homogeneous coating. Panacol's new frame-and-fill adhesives are perfectly matched so that the frame and fill areas can be optimally dispensed wet-on-wet without the still-liquid adhesives leading to undesired flowing on the PCB.
The frame material, Structalit® 5704, is a black, thermally curable and single-component epoxy. This frame and glob top compound features excellent bead stability and high glass transition temperature of 150°C up to 190°C, depending on the curing parameters and the layer thicknesses. When using Structalit® 5704, no bleeding effects occur. Due to the very low ion content of less than 20 ppm, Structalit® 5704 is suitable for chip encapsulation on electronic circuit boards.
As a fill material, Panacol has developed a range of adhesives with different rheological properties. The adhesives Structalit® 5717 to Structalit® 5721 are formulated with optimized flow behavior, so that the adhesives can be used on various chip and bonding wire geometries due to the differently adjusted viscosities. Since the fills have the same chemical base as the frame material, the excellent physical and chemical properties of high glass transition range, ion purity, temperature stability and minimal shrinkage behavior are also found in the fillls.
Once cured, Structalit® 5704 and the matching fill of the Structalit® 5717-5721 series form a black, opaque and scratch-resistant coating. These properties together with a temperature resistance of up to 200°C ensure maximum reliability.
New Epoxy Potting Compound Structalit® 5894-1 has Excellent Flow Properties
Panacol recently launched a new potting compound for electronics with medium viscosity and small filler particle size: Structalit® 5894-1 is the perfect choice for large volume potting or glob top sealing of power electronics.
Structalit® 5894-1 is a black, one part epoxy resin which requires no mixing. The combination of optimised viscosity and the small particle size of its fillers means it flows well and makes an excellent electrical potting compound. As an additional benefit, the low filler weight makes this potting epoxy less abrasive during application.
Structalit® 5894-1 cures rapidly when exposed to heat, which allows faster processing of large volume electronic component potting and sealing. Once cured, the epoxy encapsulant provides a smooth and level surface which is, at the same time, shock and scratch resistant.
New Medical Grade Epoxy for Temperature Sensitive Substrates
Techsil adds epoxy-based adhesive Structalit® 8801 to its portfolio of medical grade adhesives. The biocompatible adhesive was specially designed by manufacturer Panacol for bonding temperature-sensitive substrates as it cures quickly at low temperatures and due to its viscosity characteristics it is perfectly suited as a potting or filling material. The beige-coloured adhesive possesses high chemical resistance against common cleaning agents used for medical devices, including isopropyl alcohol. It develops high bond strength with ceramics, metals and many plastics. Structalit® 8801 cures very quickly at low oven temperatures; at 100°C this adhesive will fully cure in only a few minutes.
Certified according to ISO 10993-5 standards, 100% solvent free and compatible with common sterilization processes such as autoclaving, gamma irradiation, E-beam and EtO.
Innovative New Potting Epoxy Cures Fast at Low Oven Temperatures
Techsil introduces a newly developed potting adhesive Structalit® 8801T, which cures rapidly at low oven temperatures. This innovative epoxy adhesive was specially formulated for temperature-sensitive applications in electronics; and its resistance against oils and fuels makes it particularly suited for automotive and aerospace applications.
An all-purpose beige-coloured single-component epoxy adhesive ideal for potting electronic components; it offers excellent chemical resistance against oils and fuels and has been successfully used where strong resistance to hot kerosene and brake fluids was needed.
Structalit® 8801T cures very quickly at low oven temperatures; at 100°C this adhesive will fully cure in only a few minutes, induction curing processes can also be used on ferromagnetic substances.
Due to its shear thinning properties Structalit® 8801T offers improved flow control and the ability for precise dispensing on components’ surfaces. This adhesive develops high bond strength on ceramics, metals and many plastics.