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Thermal Management

Techsil offer a range of thermally conductive silicones and epoxies to aid with your thermal management. Suitable for Power modules; Converters; IGBT units; Semiconductor packages e.g. CPU's; Power Sensors; Board assemblies; LED's; Power supplies and Automotive Control Units.

Techsil Thermal Management

Today’s electronics are smaller and more powerful than ever, leading to ever increasing thermal challenges for the systems designer. While fans, heat sinks, and even liquid cooling and thermoelectric devices can be used to provide enough cooling power, the problem remains to get the heat from the hot components into the cooling hardware. Thermal Interface Materials (TIMs) are designed to fill in air gaps and microscopic irregularities, resulting in dramatically lower thermal resistance and thus better heat dissipation and cooling.

The range of applications where the use of thermally conductive material is necessary has greatly increased as technological advances have resulted in hotter operating temperatures. Techsil supply a comprehensive range of high performance Thermal Interface Materials (TIM) with high thermal conductivity. These include greases, pastes, adhesives (heat cure and condensation cure), gels, encapsulants, tapes and thermal pads.

Key features: Thermal conductivity; Low thermal resistance at thin bond lines; Good mechanical properties; Ageing stable elasticity
Key benefits: Extended component life; Reliability; Compensate for thermal expansion mismatch; High productivity
Application examples: Power modules; Converters; IGBT units; Semiconductor packages e.g. CPU's; Power Sensors; Board assemblies; LED's; Power supplies and Automotive Control Units.

 

Press

Techsil: Cooling Down the Thermal Management Market(June 2014)

 

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